| 发明名称 |
METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN METAL CONTACTS |
| 摘要 |
Methods and arrangements are described for forming an array of contacts for use in packaging one or more integrated circuit devices. In particular, various methods are described for forming contacts having thicknesses less than approximately 10 mum, and in particular embodiments, between 0.5 to 2 mum. |
| 申请公布号 |
US2010015329(A1) |
申请公布日期 |
2010.01.21 |
| 申请号 |
US20080174046 |
申请日期 |
2008.07.16 |
| 申请人 |
NATIONAL SEMICONDUCTOR CORPORATION |
发明人 |
NGUYEN LUU T.;PODDAR ANINDYA;LEE SHAW W.;PRABHU ASHOK S. |
| 分类号 |
B05D5/12;B05D3/06;C23C18/16 |
主分类号 |
B05D5/12 |
| 代理机构 |
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