| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that completely prevents a wire connecting a semiconductor element and a lead terminal to each other from coming into contact with an adjacent lead terminal due to a wire movement. <P>SOLUTION: A lead frame 9 includes a mounting piece 10 where a semiconductor element 1 is mounted, and lead terminals 11 to 15 having base end portions 11a to 15a, and wires 21 to 25 are connected between connection terminals of the semiconductor element 1 and the base end portions 11a to 15a of the lead terminals 11 to 15 and molded with a sealing resin to constitute the semiconductor device 1a. Contact preventing means 31a and 31b for preventing the wires 21 and 25 connected to the base end portions 11a and 15a of the adjacent lead terminals 11 and 15 adjoining the lead terminals 12 and 14 from coming into contact with the lead terminals 12 and 14 owing to a wire movement caused by flow pressure of the sealing resin injected upon molding with the sealing resin, are provided at the base end portions 12a and 14a of the lead terminals 12 and 14. <P>COPYRIGHT: (C)2010,JPO&INPIT |
