| 摘要 |
PROBLEM TO BE SOLVED: To impart a sufficient thermal stress relaxing function to a heat sink without lowering thermal conductivity from a semiconductor element to the heat sink, and to avoid an excessive decrease in rigidity of the heat sink. SOLUTION: A case portion 18 of the heat sink 16 includes a bonding region S where a second metal plate 15 is bonded and a non-bonding region P where the second metal plate 15 is not bonded. In the case portion 18, a first partitioning wall 20 which has an upper end portion 20a bonded to an upper internal surface 18d of the case portion 18 and also has a lower end portion 20b not bonded to a lower internal surface 18e of the case portion 18, and a second partitioning wall 21 which has both an upper end portion 21a and a lower end portion 21b bonded to the upper internal surface 18d and lower internal surface 18e of the case portion 18 are provided. The first partitioning wall 20 is arranged as a partitioning wall passing a position corresponding to the bonding region S and only the second partitioning wall 21 is arranged as a partitioning wall passing only a position corresponding to the second non-bonding region P2. COPYRIGHT: (C)2010,JPO&INPIT |
