| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate and a transparent body manufacturing method that applies microfabrication by laser etching to a semiconductor substrate used in a light-emitting diode or the like, and a transparent body such as a quarts substrate used in a mold or the like for optical imprint, and a light-emitting diode that has high light-emission efficiency by the manufacturing method. Ž<P>SOLUTION: In the semiconductor device and the transparent body manufacturing method, a light-transmissive mask 20A is formed by vapor deposition on an LED operation layer 3 being a semiconductor substrate, and a transparent body. Each bottomed hole 21A formed at the light-transmissive mask 20A is set smaller than the spot size SS of laser light LZ. A fluid light-absorbing material 24 is filled into each bottomed hole 21A. If the fluid light-absorbing material 24 filled into each bottomed hole is irradiated with the laser light LZ, laser etching finer than the spot size SS of the laser light LZ becomes possible. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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