| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component bonding device that improves both versatility and area productivity. <P>SOLUTION: In a construction in which an intermediate stage 5 is arranged between a substrate positioning stage 4 and an electronic component supply stage 3 and it is possible to select either a mode for transferring an electronic component taken out of the electronic component supply stage 3 by a pickup head 6 and mounted on the intermediate stage 5 to the substrate positioning stage 4 by a bonding head 10A or a mode for transporting the electronic component taken directly out of the electronic component supply stage 3 to the substrate positioning stage 4 by means of the bonding head 10A, a pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of a beam member 8b of a gantry frame 8 positioned at the end of a base 2, and a space S allowing entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
