| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat conductive silicone composition exhibiting both of good high thermal conductivity and insulating property. Ž<P>SOLUTION: The heat conductive silicone composition has a viscosity of 100 to 1,000 Pas at 25°C before cured, and contains: (A) organopolysiloxane having a specified viscosity and having two or more alkenyl groups bonded to silicon atoms in one molecule; (B) organohydrogenpolysiloxane having two or more SiH groups in one molecule; (C) Al powder having an average particle diameter of 0.5 to 50 μm and an oxygen amount of 0.5 to 5.0 mass%; (E) at least one kind selected from (E1) organosilane expressed by the formula of R<SP>1</SP><SB>a</SB>R<SP>2</SP><SB>b</SB>Si(OR<SP>3</SP>)<SB>4-a-b</SB>and (E2) hydrolyzable methylpolysiloxane having three functional groups at one end shown in the figure; (F) a catalyst selected from a group of platinum and platinum compounds; (G) a reaction controlling agent selected from acetylene compounds, nitrogen compounds, organic phosphorus compounds, oxime compounds and organic chlorine compounds; and (D) heat conductive powder other than the Al powder component (C), having an average particle diameter of 0.1 to 5.0 μm. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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