发明名称 MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD
摘要 A material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. The material includes a non-conductive base material and a catalyst adhering layer, provided on the non-conductive base and including a water-insoluble polyester resin The catalyst adhering layer shows a contact angle of 60° or smaller to purified water.
申请公布号 US2010016147(A1) 申请公布日期 2010.01.21
申请号 US20080525462 申请日期 2008.02.01
申请人 KIMOTO CO, LTD. 发明人 OHTA TETSUJI;KITAMURA KEIKO;WATANABE MITSUHIRO
分类号 B01J31/06;B01J37/34 主分类号 B01J31/06
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