发明名称 |
CU ALLOY WIRING FILM, TFT ELEMENT FOR FLAT-PANEL DISPLAY USING THE CU ALLOY WIRING FILM, AND CU ALLOY SPUTTERING TARGET FOR DEPOSITING THE CU ALLOY WIRING FILM |
摘要 |
An object of the present invention is to provide: a Cu alloy wiring film that makes it possible to use Cu having a low electrical resistivity as a wiring material, exhibit a high adhesiveness to a glass substrate, and avoid the danger of peel off from the glass substrate; a TFT element for a flat-panel display produced with the Cu alloy wiring film; and a Cu alloy sputtering target used for the deposition of the Cu alloy wiring film. The present invention is a wiring film 2 composing a TFT element 1 for a flat-panel display and a sputtering target used for the deposition of the film and the material comprises Cu as the main component and at least one element selected from the group consisting of Pt, Ir, Pd, and Sm by 0.01 to 0.5 atomic percent in total. The wiring film 2 is layered on a glass substrate 3 and further a transparent conductive film 5 is layered thereon while an insulating film 4 is interposed in between.
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申请公布号 |
US2010012935(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20070517362 |
申请日期 |
2007.12.04 |
申请人 |
KABUSHIKI KAISHA KOBE SEIKO SHO(KOBE STEEL LTD) |
发明人 |
HINO AYA;TOMIHISA KATSUFUMI;GOTOU HIROSHI;ONISHI TAKASHI |
分类号 |
H01L29/786;C23C14/34;H01L23/48 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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