发明名称 |
Contact Structures in Substrate Having Bonded Interface, Semiconductor Device Including the Same, Methods of Fabricating the Same |
摘要 |
On embodiment of a contact structure may include a lower insulation layer on a lower substrate, an upper substrate on the lower insulation layer, a groove penetrating the upper substrate to extend into the lower insulation layer, the groove below an interface between the upper substrate and the lower insulation layer, an upper insulation layer in the groove, and a contact plug penetrating the upper insulation layer in the groove to extend into the lower insulation layer.
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申请公布号 |
US2010012980(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20090504989 |
申请日期 |
2009.07.17 |
申请人 |
SONG MIN-SUNG;JUNG SOON-MOON;KIM HAN-SOO;RAH YOUNG-SEOP;CHO WON-SEOK;SON YANG-SOO;KIM JONG-HYUK;JANG YOUNG-CHUL |
发明人 |
SONG MIN-SUNG;JUNG SOON-MOON;KIM HAN-SOO;RAH YOUNG-SEOP;CHO WON-SEOK;SON YANG-SOO;KIM JONG-HYUK;JANG YOUNG-CHUL |
分类号 |
H01L29/68;H01L21/768;H01L23/52 |
主分类号 |
H01L29/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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