| 摘要 |
<P>PROBLEM TO BE SOLVED: To significantly improve reliability and long-term stability of a light emitting device in which a semiconductor light emitting element is sealed by resin. <P>SOLUTION: A light emitting device has a first semiconductor light emitting element mounted on a first lead, semiconductor element mounted on a second lead, a first wire connecting the first semiconductor light emitting element and the second lead, a second wire connecting the semiconductor element and first lead, and a silicone resin provided to cover the first semiconductor light emitting element and semiconductor element. A first notch is provided between a part where the first semiconductor light emitting element is mounted and part where the second wire is connected. A second notch is provided between a part where the semiconductor element is mounted and part where the first wire is connected. The part where the first semiconductor light emitting element is mounted protrudes toward the second lead side. The part where the semiconductor element is mounted protrudes toward the first lead side. <P>COPYRIGHT: (C)2009,JPO&INPIT |
