| 摘要 |
<p>Polyol compounds (I) are new. Polyol compounds of formula (I) are new. A : (n+q+r+s)-valent polyol after removal of (n+q+r+s) hydroxyl group, where the polyol is preferably 2,2-bis-hydroxymethyl-1,3-propane diol, 3-(3-hydroxy-2,2-bis-hydroxymethyl-propoxy)-2,2-bis-hydroxymethylpropan-1-ol, glycerin, 2-ethyl-2-(hydroxymethyl)-1,3-propanediol, 2-(hydroxymethyl)-2-methyl-1,3-propane diol, 2,2'-oxybis(methylene)bis(2-ethylpropan-1,3-diol), 2,2'-oxybis(methylene)bis(2-methylpropan-1,3-diol), diglycerin or triglycerin; X 1>-C(=O)- or -C(=O)-R4a-C(=O)-X 3>-; X 2>O, -C-C(=O)- or -NH-C(=O)-; X 3>O or NH; R1a : optionally saturated 4-30C (preferably 6-20C) alkyl; R2a : H or optionally saturated 1-30C (preferably 6-20C) alkyl; R3a : alkyl or 6-30C (preferably 6-20C) alkylphenyl; R3a : aliphatic aromatic, cycloaliphatic or optionally saturated divalent radical having 1-10C, preferably 2-8C; t : 0 or 1, preferably 0; and n, q, r, s : 0-5, where s is preferably 1 or 2. With the proviso that: at least two of n, q and r are different from zero; and the sum of (n+q+r+s) is preferably 3 or 4. Independent claims are included for: (1) a thermosetting epoxy resin composition (II) comprising at least one epoxy resin with an average of more than one epoxide per molecule, at least a curing agent for epoxy resin, which is activated by increased temperature, and at least one compound (I); (2) a two-component epoxy resin composition (III) comprising a resin component and a hardener component, where the resin component comprises at least one epoxy resin with an average of more than one epoxide group per molecule and at least one compound (I), and the hardener component comprises at least one polyamine and/or polymercaptan; and (3) a cured composition obtained either by heating and subsequent crosslinking of (II), or by mixing the resin component and the hardener component and subsequent crosslinking of (III). [Image].</p> |
