| 摘要 |
An assembly comprising a first printed circuit board, PCB (5), with a ball grid array, BGA (6), on its underside, a second PCB (8) facing the first PCB and having at least one through-hole (11) between its top and bottom surfaces, its top surface printed with a circuit pattern bonded to the BGA, a heat sink layer (9) facing the bottom surface of the second PCB and having at least one thermally-conductive pin projecting normally into the through-hole (11) or a respective one of the through-holes in the second PCB, and, for each pin, a thermally-conductive stud of the same cross-section as the pin, bonded to the BGA (6) and disposed within the through-hole (11) between the pin and the first PCB in thermal contact with the pin. |
