| 摘要 |
FIELD: electrical engineering. ^ SUBSTANCE: invention relates to multi-layer element with replicable lacquer layer wherein relief structure is formed and conducting coating is integrated. Proposed multilayer element (11, 12) has replicable lacquer layer (22). First relief structure (25, 125, 65) is formed in replicable lacquer layer (22) in the plane located in coordinate axes x and y, in multi-layer element first zone. Note here that conducting coating (231, 23n, 123n) with constant surface density is applied on replicable lacquer layer (22) in the first zone of multi-layer element (11, 12) and in adjacent second zone of said element. First relief structure (25, 125, 65) represents a structure with high depth-to-height ratio of separate structural elements, e.g. with depth-to-height ratio >2. Vertical, or almost vertical, side face passes over all, or almost all, depth of relief structure to reduce or eliminate the coating electrical conductance. ^ EFFECT: lower costs, higher accuracy in production. ^ 23 cl, 7 dwg |
