BLOCK COPOLYMER OF POLYIMIDE AND POLYAMIC ACID, METHODE FOR ITS PRODUCTION, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE BLOCK COPOLYMER AND PROTECTIVE FILM PROVIDED THEREOF

摘要

PURPOSE: A photosensitive composition including a block copolymer of polyamic acid and polyimide is provided to obtain high definition because the solubility to the alkali water solution is controlled, and to obtain an ITO insulating layer of OLED and a semiconductor protective film with excellent time-course stability. CONSTITUTION: A polyimide-polyamic acid copolymer has a structure represented by chemical formula 1. In chemical formula 1, R1, R2, and R3 are the same or different and represent tetravalent functional group induced from dianhydride substituted with a carboxyl group; X1, X2, and X3 are the same or different and represent divalent organic group induced from diamine; at least one of A1 and A2 is at least one kind of substituent selected from the group consisting of hydroxyl group, phenolic hydroxyl group, and carboxyl group.