发明名称 Image sensor and method of manufacturing the same
摘要 An image sensor and a method of manufacturing the same are provided. The image sensor includes a semiconductor substrate, a metal line layer, a first conduction type conducting layer, a first pixel isolation layer, an intrinsic layer, and second conduction type conducting layer. The semiconductor substrate includes a circuit region. The metal line layer including a plurality of metal lines and an interlayer insulating layer is formed on the semiconductor substrate. The first conductive layer having patterns separated from each other by the pixel isolation layer is formed on the metal lines. The first pixel isolation layer is formed between the separated patterns of the first conduction type conducting layer. The intrinsic layer is formed on the first conductive layer and the first pixel isolation layer. The second conduction type conducting layer is formed on the intrinsic layer.
申请公布号 US7649219(B2) 申请公布日期 2010.01.19
申请号 US20070842580 申请日期 2007.08.21
申请人 DONGBU HITEK CO., LTD. 发明人 KIM SEONG GYUN
分类号 H01L31/062;H01L27/146;H01L31/10;H04N5/335;H04N5/359;H04N5/369;H04N5/374 主分类号 H01L31/062
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