发明名称 |
System and method of detecting IC die cracks |
摘要 |
A structure and method is utilized to detect cracks, fissures, fractures, or other dislocations in an IC die. A conductive line in a metal layer is provided about the periphery of the IC die. A break in the conductive line indicates that the IC die is cracked. A JTAG interface can be utilized to provide an indication of whether the die is cracked.
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申请公布号 |
US7649200(B1) |
申请公布日期 |
2010.01.19 |
申请号 |
US20050133108 |
申请日期 |
2005.05.19 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
MILLER ROY MARK;PREJEAN SETH J. |
分类号 |
H01L23/58 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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