| 摘要 |
This invention provides a laminated film for electronic component mounting, which is excellent in adhesion between a conductor layer and an insulating film, can realize a very high light transmittance and a colorless state of the insulating film after patterning the conductor layer, can further realize wiring patterning of a fine pitch, and has excellent tensile strength, folding resistance and other properties, and a film carrier tape for electronic component mounting. A laminated film for electronic component mounting (20) comprises an insulating film (12) provided on a conductor layer (11). The conductor layer (11) contains columnar copper crystal particles having a major axis length of not less than 3 μm and is formed of an electrolytic copper foil having a thickness of not more than 15 μm and an elongation of not less than 5% at 25°C. The insulating film (12) has a light transmittance of more than 67% and not more than 95% and is formed of a substantially colorless polyimide layer. |
