METHOD OF MANUFACTURING CHIP EMBEDDED PRINTED CIRCUIT BOARD

摘要

PURPOSE: A method of manufacturing a chip embedded printed circuit board is provided to improve productivity by reducing costs and times required for manufacturing the chip embedded printed circuit board. CONSTITUTION: An upper core substrate(10) has a first chip(20) and a first circuit pattern(11). A first chip comprises a first pad. A first circuit pattern is formed on both sides of the upper core substrate. A bottom core substrate(40) having a second chip(50) and a second circuit pattern(41). The second chip comprises the second pad. The second circuit pattern is formed in both sides of the bottom core substrate. A first insulation layer has a plurality of bumps(73) and a metal pattern(70a). The metal pattern is electrically connected to the bump. The metal pattern is formed on the one-side of the first insulation layer. The first insulation layer is arranged between the upper core substrate and the bottom core substrate. The upper core substrate, and the first insulation layer, and bottom core substrate are laminated successively.