发明名称 |
Semiconductor package |
摘要 |
Provided are a semiconductor package and a method for manufacturing the same. The semiconductor package includes: a substrate having a top surface on which a lead is formed and a bottom surface opposite to the top surface; a semiconductor chip attached to the top surface of the substrate and having an active surface on which a chip pad is formed and a back surface opposite to the active surface; a redistribution pattern electrically connected to the chip pad and extending from the active surface to a lateral surface of the semiconductor chip; and an interconnector electrically connecting the redistribution to the lead on the lateral surface of the semiconductor chip.
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申请公布号 |
US7649250(B2) |
申请公布日期 |
2010.01.19 |
申请号 |
US20070940178 |
申请日期 |
2007.11.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK TAE-SUNG |
分类号 |
H01L23/48;H01L23/02;H01L23/495;H01L23/52 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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