| 摘要 |
PURPOSE: An apparatus of treating a substrate in a single wafer type is provided to prevent a substrate which is completely cleaned and dried from being polluted due to chemical fume by having a door for loading and unloading the substrate. CONSTITUTION: An apparatus of treating a substrate in a single wafer type comprises a cleaning chamber(130), a drying chamber(150), a spin chuck(121), and doors(135,151). The cleaning chamber cleans the substrate. The drying chamber comprises a door(156) for loading and unloading the substrate which is formed on one side of the cleaning chamber. The spin chuck on which a substrate is placed rotates and moves linearly inside the cleaning chamber or the drying chamber. The door is formed between the cleaning chamber and the drying chamber and is opened and closed to move the spin chuck linearly or seals the drying chamber during drying the substrate.
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