| 摘要 |
PURPOSE: A wafer level camera module and a manufacturing method thereof are provided to prevent burst or looseness of an adhesive, cased by gas expansion, by forming a groove for gas discharge in the inner upper side of a housing adhered with a lens assembly. CONSTITUTION: An image sensor(10) includes a light receiving unit in an upper side. A lens assembly(100) is adhered onto the image sensor, and includes a light incidence port. A housing(60) surrounds the side of the lens assembly including the image sensor, and includes one or more groove(60a) in the outside of the light incidence port. The housing includes an opening(65) for exposing the light incidence port of the lens assembly. The groove is contacted to the opening. A first adhesive(70) is applied between the housing and the upper side of the lens assembly.
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