LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MAKING THE SAME

摘要

PURPOSE: A light emitting device package and a manufacturing method thereof are provided to improve luminous efficiency by preventing optical absorption by a wall as a cup part is not formed on a substrate. CONSTITUTION: A light emitting device package comprises a metallic board(27) and an emitting device(30). A metal substrate comprises a first cut part(21a), a second cut part(22a), a first lead frame(21), and a second lead frame(22). The first cut part is inserted into a plane part(21b) and one side. In the first lead frame, an injection product is formed on the upper side and the lower side of a first cut part. The second cut part is press-fitted into one side and the injection product is formed on the upper side and the lower side of the second cut part. The second lead frame is separated by the injection product. A light emitting device is mounted on the plane part.