| 摘要 |
PURPOSE: A wet cleaning apparatus for a wafer is provided to remove foreign materials or stain from the wafer effectively by generating fine bubbles in a cleaning liquid filled in a cleaning bath. CONSTITUTION: A bubbling unit(200) is provided under a substrate mount(130) and generates minute bubbles inside a cleaning bath to remove foreign materials and stain from a wafer. The bubbling unit comprises a bubbling portion(210) and a nitrogen supply portion. The bubbling portion comprises a first supply pipe which is connected to the inner bottom of the cleaning bath to feed nitrogen, and a second supply pipe with fine through holes to inject the nitrogen into the cleaning liquid in the cleaning bath. The nitrogen supply portion supplies nitrogen to the bubbling unit.
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