| 摘要 |
PHYSICAL FORCES SUFFICIENT TO DEFORM AN ELECTRONIC DEVICE (700) AND/OR PACKAGING FOR THE ELECTRONIC DEVICE CAN DAMAGE THE DEVICE. SOME MECHANICAL COMPONENTS IN A DEVICE, FOR EXAMPLE, IN A MICROELECTROMECHANICAL DEVICE AND/OR IN AN INTERFEROMETRIC MODULATOR (722) ARE PARTICULARLY SUSCEPTIBLE TO DAMAGE. ACCORDINGLY, PROVIDED HEREIN IS A PACKAGING SYSTEM AND PACKAGED ELECTRONIC DEVICE THAT RESISTS PHYSICAL DAMAGE, A METHOD FOR MANUFACTURING THE SAME, AND A METHOD FOR PROTECTING AN ELECTRONIC DEVICE FROM PHYSICAL DAMAGE. THE PACKAGING SYSTEM FOR THE ELECTRONIC DEVICE INCLUDES ONE OR MORE SPACERS (730) THAT PREVENT OR REDUCE DAMAGE TO THE ELECTRONIC DEVICE ARISING FROM CONTACT WITH THE BACKPLATE (750). IN SOME EMBODIMENTS, THE PACKAGED ELECTRONIC DEVICE COMPRISING SPACERS IS THINNER THAN A COMPARABLE DEVICE MANUFACTURED WITHOUT SPACERS.
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