| 摘要 |
PURPOSE: A contactor for a semiconductor device test and a manufacturing method thereof are provided to produce a contactor improved in durability, abrasion resistance, friction resistance, service life, adhesion, planarity, formability, and wash performance by employing CCL(Copper Clad Laminate) film. CONSTITUTION: A contactor for a semiconductor device test comprises a middle plate(120), an upper plate(110), and a lower plate(130). The middle plate has a plurality of middle holes corresponding to a ball lead(11) of a semiconductor device(10), a first plating layer containing a conductive metal on the inner wall surface of each middle hole, and a first plating plate which is extended on the upper and lower circumferences of each middle hole from the first plating layer. The upper plate has a plurality of upper holes corresponding to the middle holes, a second plating layer containing a conductive metal on the inner wall surface of each upper hole, and a second plating plate which is extended on the upper and lower perimeters of each upper hole from the second plating layer. The lower plate has a plurality of lower holes corresponding to the middle holes, a third plating layer containing a conductive metal on the inner wall surface of each lower hole, and a second plating plate which is extended on the upper and lower perimeters of each upper hole from the third plating layer.
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