| 摘要 |
PURPOSE: A semiconductor package and a semiconductor device are provided to minimize the exterior size by arranging the terminals of the semiconductor package without increasing the interval between the terminals. CONSTITUTION: A semiconductor package comprises a package body(12) and tapered terminals(14). The tapered terminals are outermost ones of multiple terminals of the package body. The tapered terminal includes an attachment portion(13) attached to the package body and a tip portion(15). The attachment portion has a first face(17) facing the adjacent terminal. The tip portion has a second face(19) facing the adjacent terminal and a third face(20) opposite to the second face. The third face is formed by gradually reducing the width of the tip portion. The second face is formed more separate from the adjacent terminal than the first face. |
