| 摘要 |
PURPOSE: A method for manufacturing a semiconductor device with a fuse and a pad is provided to improve laser repair efficiency and prevent crack from occurring during wire bonding by regulating the thickness of the fuse and the pad desirably. CONSTITUTION: A method for manufacturing a semiconductor device comprises the steps of: forming a fuse and a pad on a substrate(20), forming a first insulating layer(21) on the overall structure so that the thickness on the fuse is smaller than that on the pad, blanket-etching the first insulating layer until the fuse(22B) is exposed but not the pad(22C), partially removing the exposed fuse into desired thickness, forming a second insulating layer on the overall structure, and performing repair/pad etching to form a fuse opening for exposing the fuse and a pad opening for exposing the pad.
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