发明名称 SOLDERING METHOD FOR CONNECTING BUS BAR ON CAPACOTOR AND PRODUCTS THEREOF
摘要 <p>PURPOSE: A method for assembling a bus bar for a capacitor and a product thereof are provided to reduce inductance of the capacitor by overlapping a pair of bus bars. CONSTITUTION: A capacitor element is comprised of a plastic film and a deposition film. The deposition film is wound or stacked on one or both sides of the plastic film. The zinc, the zinc alloy, the tin, or the zinc and tin are sprayed on both sides of the deposition film. A pair of bus bars(1,2) are connected to both sides of the capacitor element. Lead frames are formed on each bus bar in zigzags. The pair of bus bars are overlapped on one side of the capacitor.</p>
申请公布号 KR20100005399(A) 申请公布日期 2010.01.15
申请号 KR20080065419 申请日期 2008.07.07
申请人 NUINTEK CO., LTD. 发明人 YANG, CHANG HOON;PARK, DAE JIN;JUN, YONG WON;PARK, CHANG GEUN;KIM, YUN RAK
分类号 H01G9/008;H01G4/005 主分类号 H01G9/008
代理机构 代理人
主权项
地址