| 摘要 |
PURPOSE: A polishing pad conditioning dresser cleaning machine of a CMP(Chemical Mechanical Polishing) apparatus is provided to prevent the scratch from being generated on the surface of a wafer by removing the foreign material remaining on the surface of a diamond disk by using a brush. CONSTITUTION: A polishing pad conditioning dresser cleaning machine(100) of a CMP(Chemical Mechanical Polishing) apparatus is composed of a cleaning cup(120), a supporting plate(150), a brush(140), upper and lower nozzles(4,5), a drain cup(130), and a motor(180). The upper side of the cleaning cup is opened to house a dresser(40). The brush is projected upwardly from both ends of the supporting plate. The upper and lower nozzles inject ultra-pure water to the upper and lower sides of the dresser. The drain cup houses and discharges the ultra-pure water and foreign material. The motor transmits the driving force for rotating the supporting plate. |
