发明名称 CIRCUIT DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a circuit device capable of preventing peeling of a sealing member and a substrate even in a situation where pressing force of fastening by a screw acts. <P>SOLUTION: A hybrid integrated circuit device 10 comprises a circuit board 18 which includes a hybrid integrated circuit formed of a conductive pattern 22 and a semiconductor element 24 and incorporated on an upper surface of the circuit board, a case member 12 having a frame shape and forming a region for sealing the hybrid integrated circuit by abutting on the circuit board 18, and a sealing resin 16 which is filled in a region surrounded by the case member 12 and seals the hybrid integrated circuit. The hybrid integrated circuit device 10 is provided with a through-hole 34 for passing through the circuit board 18 of a part, which in turn is the part of the upper surface of the circuit board 18 and is not coated with the sealing resin 16. A structure for fitting an end part of the circuit board 18 and the case member 12 is adopted so as to prevent separation of the circuit board 18 and the case member 12 in fastening by the screw. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010010568(A) 申请公布日期 2010.01.14
申请号 JP20080170575 申请日期 2008.06.30
申请人 SANYO ELECTRIC CO LTD;SANYO SEMICONDUCTOR CO LTD 发明人 YANAGIDA TAKAHITO;NAGASHIMA KEN;INAGAKI YUKI
分类号 H01L23/28 主分类号 H01L23/28
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