| 摘要 |
A method of sputtering a component includes positioning a conductive substrate into a vacuum chamber, wherein the conductive substrate is tubular and has a surface. A source electrode including a source material may be inserted into the conductive substrate. A first bias voltage DeltaVac1 may be applied between the conductive substrate and the vacuum chamber and a second bias voltage DeltaVas1 may be applied between the source electrode and the vacuum chamber, sputtering the source material onto the conductive substrate.
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