| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor which has a light transmissivity necessary to optical transmission in an optical semiconductor device such as a photo coupler, and is excellent in reflow resistance, and to provide an optical semiconductor device using the composition. <P>SOLUTION: The epoxy resin composition contains an epoxy resin, a curing agent, a curing accelerator and an inorganic filler as essential components, and is characterized in that the composition contains, as the curing accelerator, an organic acid salt of a quaternary phosphonium expressed by formula (I), wherein each R independently represents an alkyl group of 2-6C, and that the compounding amount of the inorganic filler is 65 to 75 mass% with respect to the whole composition. <P>COPYRIGHT: (C)2010,JPO&INPIT |
