发明名称 HEAT INSULATION STRUCTURE OF FLOOR
摘要 PROBLEM TO BE SOLVED: To provide a heat insulation structure of a floor, which reliably supports floor panels, and facilitates construction of floor heat insulation materials. SOLUTION: A floor heat insulation layer is formed as follows: support sides of each floor panel 3 made of a concrete material such as ALC, are supported by a continuous footing 1 and a steel beam 2 as floor bearing beams, via a floor panel bearing member 4 which is made of a hollow member or a foamed member and has a heat insulation properties higher than that of the floor panel 3. Also, a floor heat insulation material 5 made of a phenol foam and molded in a plate-shape is arranged along a lower surfaces of the floor panel 3 by supporting its end, so as to be continuous to the floor panel bearing member 4. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010007302(A) 申请公布日期 2010.01.14
申请号 JP20080165876 申请日期 2008.06.25
申请人 ASAHI KASEI HOMES CO 发明人 SHIRAIWA FUMITOSHI
分类号 E04B1/80;E04B5/02 主分类号 E04B1/80
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