| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board capable of reducing the impedance of a wiring pattern, and its method for manufacturing. SOLUTION: A high dielectric constant insulating layer 42 is formed on a metal layer 10 via an adhesive layer 41. Wiring patterns W1 and W2 are formed so that side surfaces and bottom surfaces of them are covered with the high dielectric constant insulating layer 42. A base insulating layer 43 is formed on the high dielectric constant insulating layer 42 so as to cover top surfaces of the wiring patterns W1 and W2. A cover insulating layer 45 is formed on the base insulating layer 43 via an adhesive layer 44. The dielectric constant of the high dielectric constant insulating layer 42 is greater than those of the base insulating layer 43 and the cover insulating layer 45. COPYRIGHT: (C)2010,JPO&INPIT
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