| 摘要 |
A sealing material is provided, upon mounting semiconductor devices and/or electronic components which are relatively weak on a circuit board, which shows sealing characteristics that enables itself to seal the semiconductor devices and/or electronic components and connections therebetween with low stress and high reliability; and suitable repairability that enables merely semiconductor devices and/or electronic components which were determined to be off-specification after being sealed to be repaired with ease. The sealing material contains at least (a) a heat-curable resin component and (b) a hardener component therefor, and is characterized in that, once the sealing material is cured by being heated, the cured material has a glass transition temperature (Tg) in a temperature range of from -80° C. to 50° C.
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