DEVICE AND METHOD FOR SAWING ELECTRONIC COMPONENTS

摘要

The invention relates to a device for separating electronic components (2), provided with: sawing means (A) and positioning means (B), wherein between the positioning means (B) and the sawing means (A) at least one transfer position (5) is defined for the purpose of transferring positioned electronic components (2). The invention further comprises a separating device (1) for electronic components (2), provided with: sawing means (A), inspection means (D) and sorting means (E), wherein between the inspection means and the sorting means at least one transfer position (36) is defined for the purpose of transferring separated electronic components (2). Finally, the invention also relates to a method for separating electronic components (2).