| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated semiconductor package allowing evaluation of output characteristics and confirmation of the connected state of wiring of the package. <P>SOLUTION: The laminated semiconductor package includes a connection pad 103 which is provided on wiring 123 to be series-connected to an SOC chip 101 and to which a ball electrode is connected, wiring connected to the wiring 123, wiring 111 connected to the wiring 123 and an inspection land part 125 connected to the wiring 111. A bonding pad 106, the connection pad 103 and the inspection land part 125 are sequentially series-connected with one another. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
