| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure of a semiconductor chip that securely discharges a component, which needs to be removed, such as flux to lower the possibility that a void is formed in an underfill and then to enhance reliability of a connection between a solder bump and an electrode. <P>SOLUTION: In the mounting structure of the semiconductor chip 1 wherein the solder bump 2 provided on a bottom surface of the semiconductor chip 1 is welded to the electrode 6 on an insulating substrate 4 and the underfill 9 is charged in a gap 8 between the semiconductor chip 1 and insulating substrate 4, the electrode 6 which is nearly circular in plan view has a sectorial notched part 6a formed inward from its peripheral edge, and a solder resist film 7 provided on the insulating substrate 4 has an opening 7a formed almost circularly in plan view to exposed at least a center portion of the electrode 6. The solder resist film 7 has a recess 7b formed on the notched part 6a such that a peripheral edge of the opening 7a covers an outer periphery of the electrode 6. The recess 7b communicates with the opening 7a. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
