| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for application which can apply a solution to a substrate so that a functional thin film having a uniform thickness can be formed thereon. <P>SOLUTION: The apparatus for applying a solution to a substrate having a recess/projection pattern where recess/projection portions are regularly formed comprises an application head 22 having a nozzle and dropping and applying the solution from the nozzle to the substrate, a mounting table 13 for relatively moving the substrate and the application head, and a control device for controlling the relative movement direction of the substrate and the application head to be displaced by a predetermined angle relative to the direction of arrangement of the recess/projection portions of the recess/projection pattern formed on the substrate when the substrate and the application head are relatively moved by the mounting table. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
