发明名称 EPOXY RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, which has good flowability and can improve the flame retardancy of a seal-cured product without needing the addition of a flame retardant and a flame-retarding auxiliary. SOLUTION: Provided is the epoxy resin liquid composition at the ordinary temperature, comprising the resin of an epoxy compound represented by formula (1) (wherein, R is H, an alkyl group, or the like), a curing agent, an inorganic filler, and a benzoxazine compound. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010006877(A) 申请公布日期 2010.01.14
申请号 JP20080165082 申请日期 2008.06.24
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 HASEGAWA TAKASHI;MIYATA YASUTAKA;KONISHI TAKANORI
分类号 C08L63/00;H01L23/29;H01L23/31 主分类号 C08L63/00
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