| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow a thermosetting adhesive material to be added with an insulating inorganic filler without degrading the toughness parameters of this material, when the thermosetting adhesive material is disposed between a pair of substrates, and which is cured by being heat-pressed to form a connecting body. Ž<P>SOLUTION: In a method for forming a connecting structure, epoxy resin and an insulating inorganic filler are used as a thermosetting adhesive material, which is provided between a pair of substrates, wherein the insulating inorganic filler content is 5 to 35 vol.%, and the insulating inorganic filler content and the elastic modulus of the thermosetting adhesive material after curing satisfy a prescribed relational formula (1), and the insulating inorganic filler content and the tensile elongation of the thermosetting adhesive material after curing satisfy a prescribed relational formula (2), and furthermore, polybutadiene based rubber particles are added to the thermosetting adhesive material, and which is cured. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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