发明名称 WAFER HOLDING JIG AND WAFER PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent a wafer from being damaged when holding the wafer. SOLUTION: A wafer holding jig 3 includes a plurality of wafer holders 12, 11 with which wafer holding grooves 13, 11 which partially hold the outer circumference of a wafer W are formed, and a holder line in which a plurality of wafer holders 12 are connected. In the wafer holding jig, a plurality of wafer holders 12 (12a, 12b) in the holder line are bent to a side where the wafer W is held with respect to the neighboring wafer holder 12 (12b, 12c), so that the outer circumference of the wafer W is held in portions of wider range than the half of the circumference. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010010432(A) 申请公布日期 2010.01.14
申请号 JP20080168510 申请日期 2008.06.27
申请人 SUMCO TECHXIV CORP 发明人 SAKAMOTO MASATSUGU;OMACHI TOMOKO
分类号 H01L21/683 主分类号 H01L21/683
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