| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for a circuit board having a low dielectric constant, a low dielectric loss tangent and excellent heat resistance and adhesion property, and to provide a prepreg and a laminate using the composition. SOLUTION: The resin composition for a circuit board includes an epoxy resin containing two or more epoxy groups in the molecule and 2,2,4-trimethyl-1,2-dihydroquinone polymer. The cured product of the resin composition for a circuit board shows a dielectric loss tangent ranging from 0.005 to 0.020 at 1 GHz. The prepreg is obtained by impregnating a substrate with the above resin composition for a circuit board. COPYRIGHT: (C)2010,JPO&INPIT
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