发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To provide a heat sink provided with a fixing member for fixing to a circuit board on which elements to be cooled are arranged in simplified structure. SOLUTION: The heat sink 10 is provided with a heat radiating part 100 formed by arranging a plurality of plate materials almost in parallel in the thickness direction thereof and a fixing member 110 for fixing to the circuit board on which the members to be cooled are arranged. At least one plate material includes an engaging structure at an area near at least one side thereof and the fixing member 110 includes a slit part having a receiving part to be fixed by coupling to the plate material with the engaging structure. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010010464(A) 申请公布日期 2010.01.14
申请号 JP20080168919 申请日期 2008.06.27
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 SASAKI CHIKA
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
代理机构 代理人
主权项
地址