| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device, which facilitates mounting (packaging) of electronic components on mounting parts of the upper surface and the lower surface of an insulating substrate thereof, thereby facilitating manufacture of the device. Ž<P>SOLUTION: An electronic component mounting board 6 has mounting parts 1a, 1b of electronic components on the upper surface and the lower surface with the electronic component 5 mounted on each of the mounting parts 1a, 1b of the insulating substrate 1 with wiring conductors 2 formed from respective mounting parts 1a, 1b to the outer circumferential parts of the lower surface. The electronic device 9 is manufactured by connecting a frame 3 with connection conductors 4 formed from the upper surface to the lower surface so as to surround the mounting part 1b on the lower surface of the insulating substrate 1 as well as connecting the connection conductor 4 to the wiring conductor 2 on the lower surface of the insulating substrate 1. Connecting the frame 3 surrounding the mounting part 5 after mounting the electronic component 5 to the mounting part 1b of the lower surface eases the mounting of the electronic component and simplifies the manufacturing. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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