Hybrid circuit structure for use in automotive-area, has low-current substrate for carrying low current components, and power substrate comprising front side with contact surface section, where low-current substrate is fastened to section

摘要

The structure has a low-current substrate (20) for carrying low current components (22a-22c) e.g. microcontroller or controller, and a power substrate (10) comprising a power substrate front side (11) with a contact surface section (30). The low-current substrate is fastened to the section by using solder connections (24), where the substrates comprise an insulation layer that is made from ceramic material e.g. aluminum oxide, glass or plastic, and a conductor path layer. A fastening device is provided for fastening a cooling body to a heat dissipating plate and/or to the power substrate. An independent claim is also included for a method for manufacturing a hybrid circuit structure.