| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board with a built-in component for which lowering of reliability as a wiring board due to remelting of a member for built-in component connection never happens, and to provide a method of manufacturing the same. <P>SOLUTION: The wiring board with the built-in component includes: a first insulating layer; a second insulating layer disposed in a laminated state for the first insulating layer; an electric/electronic component embedded in the second insulating layer; a wiring pattern sandwiched between the first insulating layer and second insulating layer and including a mounting land for the electric/electronic component; and a connection member connecting a terminal of the electric/electronic component to the mounting land, and having a resin portion having been cured and a conduction portion which contains a metal of ≤240°C in melting point contained in the resin portion and particles of a second metal having surfaces covered with a multiple element containing phase of a first metal as one of composition metals of the metal to have a melting point of ≥260°C by changing into the multiple element containing phase containing the second metal different from the first metal, the multiple element containing phase being successively connected in the resin portion to form a conductive skeleton structure. <P>COPYRIGHT: (C)2010,JPO&INPIT |
