| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that there is the cause that the temperature of a 2-field camera is changed, a focus is displaced and a defective is generated because the 2-field camera is used for confirming and adjusting a final place at a time when a semiconductor chip and a circuit board are joined in a heating-pressing manner but the 2-field camera is arranged adjacently to a heating section in a flip-chip bonder device. <P>SOLUTION: The accurate position of the focus can be kept by uniformly cooling the whole 2-field camera and removing the distortion of the whole 2-field camera. Consequently, the generation of the defective can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT |
