| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for mounting a semiconductor module suitable for miniaturization of a power conversion device. <P>SOLUTION: The power conversion device is structured with semiconductor modules 11, 12 of the same structure connected in parallel to each other. The semiconductor modules 11, 12 have: a pair of semiconductor switches connected in series; positive electrode terminals 11P, 12P and negative ones 11N, 12N provided at edges of each semiconductor module and connected to the pair of semiconductor switches; and positive electrode control terminals 11GP, 11GN and negative ones 12GP, 12GN provided at the facing edges. A control circuit board 2, which controls each switching element, is arranged within a projection area of one semiconductor module 12. Positive electrode control circuits 20P1, 20P2, which control the positive electrode side switching elements, are arranged at the side of the negative side control terminal 12GN of the semiconductor module 12, and negative electrode control circuits 20N1, 20N2, which control the negative electrode side switching elements, at the side of the positive control terminal 12GP. <P>COPYRIGHT: (C)2010,JPO&INPIT |
