| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate unit having an electronic component and a substrate mounted with it, a substrate used therefor, and an electronic device, wherein stress concentration on a bonding position of a terminal and the substrate is suppressed. Ž<P>SOLUTION: The substrate unit has the electronic component 13 having a plurality of solder bumps 14; and the substrate 12 having a substrate member 22 mounted with the electronic component 13 and having a plurality of substrate terminals 19 electrically connected to the solder bumps 14, and a flexible region 23 enclosing the substrate member 22. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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